Mar

29

Podcasts from 2007 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics,

Filed Under Metrology, Movers and Shakers, Related Industry | Leave a Comment


Wilfried Vandervorst
Michael Garner
Alain Diebold
David Seiler
Bob McDonald
Mike Garner
Lori Nye

The 2007 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (formerly titled Characterization and Metrology for ULSI Technology), held from March 27-29, 2007 at the National Institute of Standards and Technology (NIST), has just ended . In light of the fact that the semiconductor industry is moving at an accelerating breadth-taking pace towards 45nm technology node, this year conference focus particularly on metrology challenges facing nanoscale and high-k/metal gate material. Below are the Semiconductor International audio interviews with industrial experts attending the conference.

1. Wilfried Vandervorst, IMEC Fellow and head of the Materials and Components Analysis group of IMEC’s Process Technology Division Ultrashallow Junctions Require 0D to 3D Analysis 3/28/2007
2. Michael Garner, manager of the External Materials Research Group, Technology Strategy, at Intel Emerging Materials and Device Metrology 3/28/2007
3. Alain Diebold, Sematech senior fellow and leader of the Metrology Council and Analytical Laboratory Managers Working Group of Sematech member companies High-k/Metal Gates Add Metrology Demands 3/22/2007
4. David Seiler, chief of the Semiconductor Electronics Division in the Electronics and Electrical Engineering Laboratory at the National Institute of Standards and Technology (NIST) Chip Variability Is Key Challenge at the Nanoscale 3/22/2007
5. Bob_MacDonald, Former vice president and CTO of Metara Maintaining Process Control in a Nano World 3/22/2007
6. Michael Garner, program manager of external materials research for the Intel Technology Strategy Organization Metrology Conference Leader Offers Preview 3/22/2007
7. Lori Nye, senior director for global marketing at Entegris Conference Focus Shifts to Nanoelectronics 3/22/2007

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Mar

28

Chartered regains number 3

Filed Under Foundry, Market Research, Semiconductor Industry | 1 Comment

top10foundry

Chartered Semiconductor regains its number 3 position in worldwide foundry ranking after losing to SMIC last year, according to preliminary estimation from Gartner. Congrad to Chartered. If Chartered could successfully woo Freescale on 45nm technology partnership by end of the year, we believe Chartered will be able to carve a strong niche in IDM partnership foundry model. This is because a number of traditional IDMs, such as NXP, TI, STMicro, Freescale, Cypress and Sony have successively announced plans to pursue foundry partnership model at 45nm technology node and below. This is certainly a good news for foundry business.

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