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One of the top semiconductor news last week was that IBM has successfully invented a manufacturable airgap chip technology that mimics nature process of forming snowflakes (Ref). The invention forms trillions of nanoscale holes on a capping layer and use them to form insulating vacuums surrounding Cu wirings inside a chip. Dr Edlestein, IBM Fellow and chief scientist of the self-assembly airgap project said:

While the self-assembled polymers were developed back in 2001, it is the first time anyone has been able to produce mass quantities and integrate them into a manufacturing process with high yields.

The new process is already integrated into a production line at IBM’s East Fishkill, New York, plant and chips will start shipping in servers in 2009. Toshiba and AMD have signed on to licence the technique too (Ref).

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Tags: airgap, Cu, Edlestein, IBM, interconnect, Related Industry, self-assembly, snow flakes, wiring

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