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iPhone 3G was launched over the last weekend. Within 3 days, more than a million iPhone 3G have been sold (Ref). The iPhone 3G manic is simply amazing and Apple has demonstrated once again its unbeatable marketing prowess. Minutes after the launch, the Internet has published a couple of articles on the teardown analysis of iPhone 3G handset. Based on these articles, we list a summary of the components used by iPhone 3G over here (Ref1, Ref2, Ref3):

• ARM Processor: Samsung
• 3G Communication: Infineon (previously Broadcom)
• GPS: Infineon
• NAND: Toshiba (previously Samsung)
• Baseband NOR: Numonyx
• Audio Codec: Wolfson Microelectronics
• Power Amplifier: TriQuint
• Power Control: NXP
• Battery and USB: Linear Technology
• Touchscreen: Broadcom, NXP, TI
• Others: Skyworks

The clear winner is obviously Infineon which has four design wins in the iPhone 3G, including the 3G communication chip. Below is a two part teardown anaysis by Semiconductor Insight.

Related posts

• iPhone Launch Mania (0)
• IBM Bigger and STM Leaner (0)
• Will IMEC become a IBM-like Technology Alliance? (0)

Tags: 3G, Apple, Broadcom, CPU, Flash memory, Infineon, iPhone, Numonyx, NXP, Samsung, Toshiba, TriQuint, Wolfson Microelectronics

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