Nov

14

Intel launched 45nm high-k metal-gate Penryn chips

Filed Under Microprocessor, Video Gallery | Leave a Comment

Keeping to its promise, Intel has launched a new series of 45nm microprocessors, code-named Penryn, on last Sunday 11 Nov. Altogether 16 new Penryn processors are launched, including quad-core Xeon 5400 for server segment and Core 2 Extreme QX9650 (also quad core) for high-end desktop segment. They are all lead-free, RoHS-compliant and most importantly they are fabricated with high-k metal-gate (HKMG) technology with gate-last integration (Ref). More details on the Penryn chips are shown in the slide show below.

The Penryn processors are the “tick” version of Intel’s product roadmap. Intel’s product strategy is based on what Intel calls a “tick-tock” basis, with every “tick” representing a new silicon process technology using an enhanced micro architecture, followed then by a “tock” which represents the design of a whole new architecture. The cycle repeats itself approximately every 2 years. The next generation “tock” version of the 45nm processors, code-named Nehalem, is slated to start initial production in 2008 (Ref).

These Penryn chips are rolling out from Intel’s new state-of-the-art 300mm 45nm Fab in Chandler, Arizona, known as Fab 32. Two additional 45nm, 300mm manufacturing factories are scheduled to open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, New Mexico (Fab 11x). (Ref). Watch the video on Intel’s Fab 32.

 

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Aug

21

TSV and DSA technology enables 3D chip

Filed Under Movers and Shakers, Process Technology, Video Gallery | Leave a Comment

AP300

Last month, Ultratech, a relatively unknown company to me, clinched the prestigious 2007 Advanced Packaging Award (APA) in the category of 3D Packaging. From the website of Ultratech, I get to know that this company is a photolithographic equipment maker founded in 1979. Compared to the more well-known photolithographic makers like ASML and Nikon, what makes this small company standing out? The answer is Ultratech’s AP300 Dual-Side Alignment (DSA) lithography system. The system uses a very innovative front-side infrared (IR) approach to perform dual-side alignment, achieving front-to-back overlay of less than 2 microns over a 300-mm wafer. As a result, it is possible to meet the stringent alignment requirement for through-silicon via (TSV) process on 300-mm wafers.

3D TSV process

TSV technology is the key enabling process for fabricating 3D chips. In April this year, IBM announced that they were close to commercialize 3D chips based on TSV process which allows them to create high-bandwidth connections between two or more chips in a stacked packaging format (Ref). There are a number of key players working on TSV technology development, including Intel (Ref) and even our local Institute of Microelectronics (Ref). Since 2002, IME has worked with 24 industry partners on various projects related to TSV technology. In Q4 2007, IME will initiate a project to develop TSV technology for large die Cu/low-k chip with very fine pitch interconnection.

Below is a very interesting video interview of Arthur W. Zafiropoulo, Chairman, Chief Executive Officer and President of Ultratech by VLSI Research Inc. Zafiropoulo talked about how his company differentiates itself from the big competitors and thus able to capture the niche market of TSV technology.

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