Jan

21

MacBook Air uses 65nm CPU and 45nm packaging hybrid

Filed Under Microprocessor, Packaging and Testing, Video Gallery | 1 Comment

Last week, Steve Jobs stunned the world by launching a superslim notebook, MacBook Air (watch the video below). Immediately after the launch, AnandTech founder Anand Lal Shimpi unveiled the CPU and packaging used in the Apple’s Macbook Air (Ref). I was a little surprised to learn that the Macbook Air is using the Intel’s 65nm 1.6GHz and 1.8GHz Merom based Core 2 Duo with a 4MB L2 cache and Intel 965GMS chipset with integrated graphics. Unlike Apple’s usual style, the MacBook Air is not adopting the latest CPUs in the market - Intel’s 45nm high-k/metal-gate Penryn chips which seem a nice fit to such a slim device. In contrast, several other PC makers were already showing off their 45nm based notebooks at CES two weeks ago.

What is even more interesting is the fact that the 65nm CPU is force fitted into an extra-small chip package supposedly to be used for the Montevina SFF Centrino platform and 45nm mobile Penryn due to be launched in the second half of 2008. The new chip package is 60% smaller then the standard package (see pictures from Anantech). I guess only Apple has the muscle to flex in order to get Intel to specially tailored such a unique hybrid of 65nm chip on 45nm package.

The hybrid of 65nm CPU and 45nm package creates an unusual blend of performance characteristics. It is just above the Low Voltage (LV series) variants in terms of clock speed and power use but considerably more efficient than the regular mobile processor, which consumes 35 watts of peak power at a minimum 1.8GHz (Ref).

The question is why Apple took such a huge trouble to tailor made a hybrid part when the 45nm Penryn chips were available 3 weeks before the launch of the MacBook Air? George Ou from Zdnet suggested it could be because during the design phase of the MacBook Air, Apple was worried that the 45nm mobile Penryn chips might not be ready in time for the launch of MacBook Air at the MacWorld. To be on the safe bet, therefore Apple opted for the hybrid design instead (Ref).

 

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Sep

19

Stunning Announcements from Intel IDF

Filed Under Microprocessor, Process Technology | Leave a Comment



The much anticipated 3 days Intel Developer Forum from 18-20 Sep is currently held at San Francisco, Moscone Center West, US. On the first day, Intel has already made a series of stunning announcments:

  • Launch the 45nm processors using high-k metal-gate process on the 12 November. These include 130W Core 2 Extreme QX6850, a four-core part running at 3GHz on a 1333MHz frontside bus and with 12MB of L2 cache on board, with 6MB shared by each core pair (Ref).
  • Ramp up its microprocessors using a 32-nanometer process technology starting in 2009 (Ref).
  • Introduce 15 new 45-nm processors by the end of 2007 and 20 in the first quarter of 2008.
  • First public demonstration of the 8-core Nehalem processor using its QuickPath Interconnect system architecture. Although the design of Nehalem has been completed, they will most like ship in 2009.
  • In response to AMD’s Fusion chip, Intel will ship its integrated cpu+gpu chip in 2008. (Ref)

For more information and analysis on Intel IDF, check out the Anantech website. Anantech folks always surprise me by their in-depth and first-hand analysis of semiconductor industry and products.

Podtech.com is also tracking the Intel IDF closely. It is publishing a series of videocasts and podcasts almost live from IDF. Watch some of there here:

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