Jul

15

iPhone 3G Teardown

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iPhone 3G was launched over the last weekend. Within 3 days, more than a million iPhone 3G have been sold (Ref). The iPhone 3G manic is simply amazing and Apple has demonstrated once again its unbeatable marketing prowess. Minutes after the launch, the Internet has published a couple of articles on the teardown analysis of iPhone 3G handset. Based on these articles, we list a summary of the components used by iPhone 3G over here (Ref1, Ref2, Ref3):

  • ARM Processor: Samsung
  • 3G Communication: Infineon (previously Broadcom)
  • GPS: Infineon
  • NAND: Toshiba (previously Samsung)
  • Baseband NOR: Numonyx
  • Audio Codec: Wolfson Microelectronics
  • Power Amplifier: TriQuint
  • Power Control: NXP
  • Battery and USB: Linear Technology
  • Touchscreen: Broadcom, NXP, TI
  • Others: Skyworks

The clear winner is obviously Infineon which has four design wins in the iPhone 3G, including the 3G communication chip. Below is a two part teardown anaysis by Semiconductor Insight.

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Jul

2

iPhone Launch Mania

Filed Under Consumer Electronics, Video Gallery | Leave a Comment

Finally, the much hyped Apple’s iPhone was launched in the United States last Friday, 29th June. Approximately 525,000 iPhones were sold out over the weekend (Ref). Apple’s CEO, Steve Jobs, touted iPhone would become Apple’s third killer product, after the Mac and iPod. From the overwhelming response of iPhone’s debut, it seems that Apple has once again successfully created the magical “cool” factor for this new product. Literally thousands of iPhone fans camped for days outside the stores to get their much awaited iPhones (Ref). Amazingly, iPhones are already selling over the ebay right after the launch with the highest selling price of $12,500 (Ref). Watch the following videos depicting the iPhone launch mania at various locations in US.

On a separate note, Semiconductor Insight did a tear down analysis of an iPhone. It revealed the iPhone is powered by Samsung processor S5L8900, Samsung’s 65-nm 8G MLC NAND flash (K9MCG08U5M) and Broadcom BCM5973A. Other chips inside iPhone come from Philips, Infineon, National Semiconductor, Texas Instrument, STMicroelectronics and Peregrine Semiconductor (Ref). Watch the video below for the iPhone tear down analysis.

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