sikod logo
sikod wafer background
Your premier source of semiconductor news
Warning: include(searchbar.html) [function.include]: failed to open stream: No such file or directory in /home4/oswebtw2/public_html/sikod/home/ieee_reliability_packaging.php on line 18
Warning: include() [function.include]: Failed opening 'searchbar.html' for inclusion (include_path='.:/usr/lib/php:/usr/local/lib/php') in /home4/oswebtw2/public_html/sikod/home/ieee_reliability_packaging.php on line 18
IEEE Device & Materials Reliabilty
- Front cover
March 1st, 2010 12:00 AM - IEEE Transactions on Device and Materials Reliability publication information
March 1st, 2010 12:00 AM - Table of Contents
March 1st, 2010 12:00 AM In Situ Poly Heater—A Reliable Tool for Performing Fast and Defined Temperature Switches on Chip
March 1st, 2010 12:00 AM- Failure Analysis of Anisotropic Conductive Film Packages With Misalignment Offsets
March 1st, 2010 12:00 AM - Using Oxide-Trap Charge-Pumping Method in Radiation-Reliability Analysis of Short Lightly Doped Drain Transistor
March 1st, 2010 12:00 AM - Fabrication of Two-Layer Thin-Film Magnetic-Field Microprobes on Freestanding SU-8 Photoepoxy
March 1st, 2010 12:00 AM - Multibit Error-Correction Methods for Latency-Constrained Flash Memory Systems
March 1st, 2010 12:00 AM - High-
March 1st, 2010 12:00 AM - Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
March 1st, 2010 12:00 AM - Stress Relaxation Testing of Stamped Metal Land-Grid-Array Sockets
March 1st, 2010 12:00 AM - Characterization of the Channel-Shortening Effect on P-Type Poly-Si TFTs
March 1st, 2010 12:00 AM - The Influence of
March 1st, 2010 12:00 AM - Failure Mechanisms of GaN Metal–Semiconductor–Metal Photodetectors After Stressing
March 1st, 2010 12:00 AM - Flashover Processes Between Conductive Paths on a Circuit Board Under Very Fast Impulse Voltages
March 1st, 2010 12:00 AM
IEEE Components & Packaging Tech.
- Front Cover
March 1st, 2010 12:00 AM - IEEE Transactions on Components and Packaging Technologies publication information
March 1st, 2010 12:00 AM - Table of contents
March 1st, 2010 12:00 AM - Development of 3-D Silicon Module With TSV for System in Packaging
March 1st, 2010 12:00 AM - Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature
March 1st, 2010 12:00 AM - Modeling Heat Transport in Thermal Interface Materials Enhanced With MEMS-Based Microinterconnects
March 1st, 2010 12:00 AM - Optimization of Piezoelectric Oscillating Fan-Cooled Heat Sinks for Electronics Cooling
March 1st, 2010 12:00 AM - Thermal Potential of Flat Evaporator Miniature Loop Heat Pipes for Notebook Cooling
March 1st, 2010 12:00 AM - Dynamic Finite Element Analysis of Failure in Alternating Phase-Shift Masks Caused by Megasonic Cleaning
March 1st, 2010 12:00 AM - Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits
March 1st, 2010 12:00 AM - Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging
March 1st, 2010 12:00 AM - Residual Strain Measurement of Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic Packaging
March 1st, 2010 12:00 AM - Capacitive Pressure Sensor With Very Large Dynamic Range
March 1st, 2010 12:00 AM - Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints
March 1st, 2010 12:00 AM - Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area
March 1st, 2010 12:00 AM
Copyright © 2006-2008. SiKOD.com. All right reserved.
This website is designed and maintained by OSWeb2Design
This website is designed and maintained by OSWeb2Design