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IEEE Device & Materials Reliabilty
- Front cover
March 1st, 2010 12:00 AM - IEEE Transactions on Device and Materials Reliability publication information
March 1st, 2010 12:00 AM - Table of Contents
March 1st, 2010 12:00 AM In Situ Poly Heater—A Reliable Tool for Performing Fast and Defined Temperature Switches on Chip
March 1st, 2010 12:00 AM- Failure Analysis of Anisotropic Conductive Film Packages With Misalignment Offsets
March 1st, 2010 12:00 AM - Using Oxide-Trap Charge-Pumping Method in Radiation-Reliability Analysis of Short Lightly Doped Drain Transistor
March 1st, 2010 12:00 AM - Fabrication of Two-Layer Thin-Film Magnetic-Field Microprobes on Freestanding SU-8 Photoepoxy
March 1st, 2010 12:00 AM - Multibit Error-Correction Methods for Latency-Constrained Flash Memory Systems
March 1st, 2010 12:00 AM - High-
March 1st, 2010 12:00 AM - Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
March 1st, 2010 12:00 AM - Stress Relaxation Testing of Stamped Metal Land-Grid-Array Sockets
March 1st, 2010 12:00 AM - Characterization of the Channel-Shortening Effect on P-Type Poly-Si TFTs
March 1st, 2010 12:00 AM - The Influence of
March 1st, 2010 12:00 AM - Failure Mechanisms of GaN Metal–Semiconductor–Metal Photodetectors After Stressing
March 1st, 2010 12:00 AM - Flashover Processes Between Conductive Paths on a Circuit Board Under Very Fast Impulse Voltages
March 1st, 2010 12:00 AM
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