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IEEE Device & Materials Reliabilty

- Front cover
June 1st, 2010 12:00 AM - IEEE Transactions on Device and Materials Reliability publication information
June 1st, 2010 12:00 AM - Table of Contents
June 1st, 2010 12:00 AM - Characterization of NBTI-Induced Interface State and Hole Trapping in SiON Gate Dielectrics of p-MOSFETs
June 1st, 2010 12:00 AM - Effects of Moist Environments on LED Module Reliability
June 1st, 2010 12:00 AM - Understanding the Mechanisms of Degradation and Failure Observed in ESD Protection Devices Under System-Level Tests
June 1st, 2010 12:00 AM - Optimizing Scrubbing Sequences for Advanced Computer Memories
June 1st, 2010 12:00 AM - Limitations of Poole–Frenkel Conduction in Bilayer
MOS Devices
June 1st, 2010 12:00 AM - Robust Register Caching: An Energy-Efficient Circuit-Level Technique to Combat Soft Errors in Embedded Processors
June 1st, 2010 12:00 AM - Modeling of Barrier-Engineered Charge-Trapping
nand Flash Devices
June 1st, 2010 12:00 AM - Low-Operating-Voltage Polymer Thin-Film Transistors Based on Poly(3-Hexylthiophene) With Hafnium Oxide as the Gate Dielectric
June 1st, 2010 12:00 AM - Optimization on Layout Style of ESD Protection Diode for Radio-Frequency Front-End and High-Speed I/O Interface Circuits
June 1st, 2010 12:00 AM - Study of Random Dopant Fluctuation Effects in FD-SOI MOSFET Using Analytical Threshold Voltage Model
June 1st, 2010 12:00 AM - Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling
June 1st, 2010 12:00 AM - Models With Failure-Free Life—Applied Review and Extensions
June 1st, 2010 12:00 AM

IEEE Trans. Reliability

- Table of contents
June 1st, 2010 12:00 AM - IEEE Transactions on Reliability publication information
June 1st, 2010 12:00 AM - Selection of Optimal Software Reliability Growth Models Using a Distance Based Approach
June 1st, 2010 12:00 AM - Anomaly Detection Through a Bayesian Support Vector Machine
June 1st, 2010 12:00 AM - Analytic Confusion Matrix Bounds for Fault Detection and Isolation Using a Sum-of-Squared-Residuals Approach
June 1st, 2010 12:00 AM - A Framework for Reliability Approximation of Multi-State Weighted
-out-of-
Systems
June 1st, 2010 12:00 AM - Dynamic Bayesian Evaluation Method for System Reliability Growth Based on In-Time Correction
June 1st, 2010 12:00 AM - Exact Reliability Formula for Consecutive-
-Out-of-
Repairable Systems
June 1st, 2010 12:00 AM - Lifetime Reliability for Load-Sharing Redundant Systems With Arbitrary Failure Distributions
June 1st, 2010 12:00 AM - Tolerance Limits for
-Out-of-
Systems With Exponentially Distributed Component Lifetimes
June 1st, 2010 12:00 AM - Computing Multi-State Two-Terminal Reliability Through Critical Arc States That Interrupt Demand
June 1st, 2010 12:00 AM - Modeling Failure Modes for Residual Life Prediction Using Stochastic Filtering Theory
June 1st, 2010 12:00 AM - Optimal Selective Maintenance Strategy for Multi-State Systems Under Imperfect Maintenance
June 1st, 2010 12:00 AM - Repair and Replacement Decisions for Warranted Products Under Markov Deterioration
June 1st, 2010 12:00 AM - A Periodic Replacement Model Based on Cumulative Repair-Cost Limit for a System Subjected to Shocks
June 1st, 2010 12:00 AM

IEEE Trans. Advanced Packaging

- Table of contents
May 1st, 2010 12:00 AM - IEEE Transactions on Advanced Packaging publication information
May 1st, 2010 12:00 AM - Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies
May 1st, 2010 12:00 AM - Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components
May 1st, 2010 12:00 AM - Distribution and Diffusion of Water in Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach
May 1st, 2010 12:00 AM - Lead-Free Solder Material and Chip Thickness Impact on Board-Level Reliability for Low-K WLCSP
May 1st, 2010 12:00 AM - Dynamics of Contact Wave in Silicon Wafer Direct Bonding
May 1st, 2010 12:00 AM - Comments on “Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging”
May 1st, 2010 12:00 AM - The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application
May 1st, 2010 12:00 AM - An Integration Technology for RF and Microwave Circuits Based on Interconnect Programming
May 1st, 2010 12:00 AM - Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management
May 1st, 2010 12:00 AM - Design and Development of Fine Pitch Copper/Low-K Wafer Level Package
May 1st, 2010 12:00 AM - Aligning Chips Face-to-Face for Dense Capacitive and Optical Communication
May 1st, 2010 12:00 AM - Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology
May 1st, 2010 12:00 AM - Electronic Packaging Materials for Extreme, Low Temperature, Fatigue Environments
May 1st, 2010 12:00 AM

IEEE Components & Packaging Tech.

- Front Cover
June 1st, 2010 12:00 AM - IEEE Transactions on Components and Packaging Technologies publication information
June 1st, 2010 12:00 AM - Table of contents
June 1st, 2010 12:00 AM - The Thermal Stability of Alkanethiol Self-Assembled Monolayers on Copper for Fluxless Soldering Applications
June 1st, 2010 12:00 AM - Evaluation of the Heat Transfer Coefficient in Microcircuits From the Frequency Analysis of the Thermal Transient Response
June 1st, 2010 12:00 AM - Thermal Spreading Resistance of Arbitrary-Shape Heat Sources on a Half-Space: A Unified Approach
June 1st, 2010 12:00 AM - Experimental Study of Uniaxial-Stress Effects on DC Characteristics of nMOSFETs
June 1st, 2010 12:00 AM - Parametric Design and Numerical Simulation of the Axial-Flow Fan for Electronic Devices
June 1st, 2010 12:00 AM - Reliability and Stress Analysis of Ink for Chip on Film Packaging
June 1st, 2010 12:00 AM - Optimal Pellet Geometries for Thermoelectric Power Generation
June 1st, 2010 12:00 AM - Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys
June 1st, 2010 12:00 AM - Electro-Thermal Analysis of In-Plane Micropump
June 1st, 2010 12:00 AM - Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging
June 1st, 2010 12:00 AM - Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design
June 1st, 2010 12:00 AM - Planar LTCC Transformers for High-Voltage Flyback Converters
June 1st, 2010 12:00 AM

IEEE Trans. Electronics Packaging Mfg

- Table of contents
April 1st, 2010 12:00 AM - IEEE Transactions on Electronics Packaging Manufacturing publication information
April 1st, 2010 12:00 AM - Measuring Manufacturing Yield for Gold Bumping Processes Under Dynamic Variance Change
April 1st, 2010 12:00 AM - A Study of Crack Propagation in Pb-Free Solder Joints
April 1st, 2010 12:00 AM - Online Postweld Shift Measurement of Butterfly-Type Laser Module Employing High-Resolution Capacitance Displacement Measurement System
April 1st, 2010 12:00 AM - Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering
April 1st, 2010 12:00 AM - Height Inspection of Wafer Bumps Without Explicit 3-D Reconstruction
April 1st, 2010 12:00 AM - Application of the Underfill Model to Bump Arrangement and Dispensing Process Design
April 1st, 2010 12:00 AM - Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects
April 1st, 2010 12:00 AM - Study of 6 mil Cu Wire Replacing 10–15 mil Al Wire for Maximizing Wire-Bonding Process on Power ICs
April 1st, 2010 12:00 AM - Evolutionary Path Planning With Subpath Constraints
April 1st, 2010 12:00 AM - Table of contents
April 1st, 2010 12:00 AM - Table of contents
April 1st, 2010 12:00 AM - IEEE Foundation
April 1st, 2010 12:00 AM - IEEE Components, Packaging, and Manufacturing Technology Society information for authors
April 1st, 2010 12:00 AM

IEEE Circuits & Devices Magazine

- IEEE Circuits and Devices Magazine
December 31st, 1969 05:00 PM - IEEE Member Digital Library
December 31st, 1969 05:00 PM - IEEE Circuits and Devices - Table of contents
December 31st, 1969 05:00 PM - From the Editor - Going...Going ...Gone!!!
December 31st, 1969 05:00 PM - VLSI Designer's Interface
December 31st, 1969 05:00 PM - The CHIP - Peak Detectors for Multistandard Wireless Receivers
December 31st, 1969 05:00 PM - Super Junction LDMOS Transistors - Implementing super junction LDMOS transistors to overcome substrate depletion effects
December 31st, 1969 05:00 PM - Tackling 4G challenges with "TACT" - Design and optimization of 4G radio receivers with a transceiver architecture comparison tool (TACT)
December 31st, 1969 05:00 PM - Putting the "FLEX" in flexible mobile wireless radios - A wideband continuous-time baudpass sigma-delta ADC software radios
December 31st, 1969 05:00 PM - Predicting random jitter - Exploring the current simulation techniques for predicting the noise in oscillator, clock, and timing circuits
December 31st, 1969 05:00 PM - RF subsystems implemented in mainstream CMOS - Overcoming special concerns affecting performance and cost
December 31st, 1969 05:00 PM - Modeling and simulation of mixed-signal electronic designs - Enabling analog and discrete subsystems to be represented uniformly within a single framework
December 31st, 1969 05:00 PM - Embeded EEPROM Memory Achieving Lower Power - New design of EEPROM memory for RFID tag IC
December 31st, 1969 05:00 PM - Breaking the optical difraction barrier with nanophotonics - Ultrahigh-resolution bioimaging and biosensing in the subwavelength nanometric range with nanobiophotonic technologies
December 31st, 1969 05:00 PM - Ultraviolet laser beam and confocal microscopy - A system for rapid patterned photolysis
December 31st, 1969 05:00 PM

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