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IEEE Device & Materials Reliabilty
- Aging and Stability of GaN High Electron Mobility Transistors and Light-Emitting Diodes With
$hbox{TiB}_{2}$
June 7th, 2008 12:00 AM - The Effect of Gate-Bias Stress and Temperature on the Performance of ZnO Thin-Film Transistors
June 7th, 2008 12:00 AM - High-Temperature Very Low Frequency Noise-Based Investigation of Slow Transients in AlGaN/GaN MODFETs
June 7th, 2008 12:00 AM - Hot-Carrier-Related Increase in Drain Resistance and Its Suppression by Reducing Contaminants in InP-Based HEMTs
June 7th, 2008 12:00 AM - Performance Degradation of High-Brightness Light Emitting Diodes Under DC and Pulsed Bias
June 7th, 2008 12:00 AM - Improved Reliability Performances of SONOS-Type Devices Using Hot-Hole Erase Method by Novel Negative FN Operations
June 7th, 2008 12:00 AM - Temperature-Dependent Characterization of AlGaN/GaN HEMTs: Thermal and Source/Drain Resistances
June 7th, 2008 12:00 AM - A New Flip-Flop-Based Transient Power Supply Clamp for ESD Protection
June 7th, 2008 12:00 AM - Time-to-Breakdown Weibull Distribution of Thin Gate Oxide Subjected to Nanoscaled Constant-Voltage and Constant-Current Stresses
June 7th, 2008 12:00 AM - Reliability of Deep-UV Light-Emitting Diodes
June 7th, 2008 12:00 AM - Degradation Uniformity of RF-Power GaAs PHEMTs Under Electrical Stress
June 7th, 2008 12:00 AM - Thermal and Mechanical Analysis of High-Power LEDs With Ceramic Packages
June 7th, 2008 12:00 AM - Reliability Estimation for Large-Area Solder Joints Using Explicit Modeling of Damage
June 7th, 2008 12:00 AM - Propensity of Copper Dendrite Growth on Subassembly Package Components Used in Quad Flat Package
June 7th, 2008 12:00 AM - In-Depth Electrical Analysis to Reveal the Failure Mechanisms With Nanoprobing
June 7th, 2008 12:00 AM
IEEE Trans. Reliability
- Inference Based on Type-II Hybrid Censored Data From a Weibull Distribution
June 7th, 2008 12:00 AM - Improvement on “Sequential Testing” in MIL-HDBK-781A and IEC 61124
June 7th, 2008 12:00 AM - Efficient Reliability Assessment of Redundant Systems Subject to Imperfect Fault Coverage Using Binary Decision Diagrams
June 7th, 2008 12:00 AM - Real-time Reliability Prediction for a Dynamic System Based on the Hidden Degradation Process Identification
June 7th, 2008 12:00 AM - Degradation Analysis of Nano-Contamination in Plasma Display Panels
June 7th, 2008 12:00 AM - Towards a Standardized Terminology for Network Performance
June 7th, 2008 12:00 AM - The Relationship Between Confidence Intervals for Failure Probabilities and Life Time Quantiles
June 7th, 2008 12:00 AM - Risk Informed Design Refinement of a Power System Protection Scheme
June 7th, 2008 12:00 AM - A Practical Algorithm for Computing Multi-State Two-Terminal Reliability
June 7th, 2008 12:00 AM - Residuals and Their Analyses for Accelerated Life Tests With Step and Varying Stress
June 7th, 2008 12:00 AM - Flowgraph Models in Reliability and Finite Automata
June 7th, 2008 12:00 AM - Lifetime of Combined
$k$ $n$ $k_{c}$ $n$
June 7th, 2008 12:00 AM - A Censored Sequential Posterior Odd Test (SPOT) Method for Verification of the Mean Time To Repair
June 7th, 2008 12:00 AM - Evaluating Reliability of Telecommunications Networks Using Traffic Path Information
June 7th, 2008 12:00 AM - A Two-Stage Failure Model for Bayesian Change Point Analysis
June 7th, 2008 12:00 AM
IEEE Trans. Advanced Packaging
- A Complete Finite-Element Analysis of Multilayer Anisotropic Transmission Lines From DC to Terahertz Frequencies
May 7th, 2008 12:00 AM - New 3-D Chip Stacking Architectures by Wire-On-Bump and Bump-On-Flex
May 7th, 2008 12:00 AM - Design and Analysis of Ultra-Miniaturized Meandering Photonic Crystals Delay Lines
May 7th, 2008 12:00 AM - Heat Driven Cooling Of Portable Electronics Using Thermoelectric Technology
May 7th, 2008 12:00 AM - A Transmission-Line Model for Full-Wave Analysis of Mixed-Mode Propagation
May 7th, 2008 12:00 AM - Effects in Surface Free Energy of Sputter-Deposited TaNx Films
May 7th, 2008 12:00 AM - An Ultra-Compact Planar Bandpass Filter With Open-Ground Spiral for Wireless Application
May 7th, 2008 12:00 AM - Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media
May 7th, 2008 12:00 AM - A Fast Computation Method in Frequency Domain for Power Ground Plane Impedance Calculation Using the Mobius Transform
May 7th, 2008 12:00 AM - Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging
May 7th, 2008 12:00 AM - Delaunay–Voronoi Modeling of Power-Ground Planes With Source Port Correction
May 7th, 2008 12:00 AM - Thermal Aging Reliability of Package-Level Polymer Optical Waveguides
May 7th, 2008 12:00 AM - A Micromachined Chip-to-Board Interconnect System Using Electroplating Bonding Technology
May 7th, 2008 12:00 AM - A Finite-Element Domain-Decomposition Methodology for Electromagnetic Modeling of Multilayer High-Speed Interconnects
May 7th, 2008 12:00 AM - 622-Mb/s Bidirectional SFP Optical Transceiver Using an Integrated WDM Optical Subassembly
May 7th, 2008 12:00 AM
IEEE Components & Packaging Tech.
- Influence of Nonuniform Initial Porosity Distribution on Adhesive Failure in Electronic Packages
June 7th, 2008 12:00 AM - Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages
June 7th, 2008 12:00 AM - High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints
June 7th, 2008 12:00 AM - An Effective Method for Calculation of Corner Stresses With Applications to Plastic IC Packages
June 7th, 2008 12:00 AM - Realization of Ultra Fine Pitch Traces on LCP Substrates
June 7th, 2008 12:00 AM - Shape Optimization of Micro-Channel Heat Sink for Micro-Electronic Cooling
June 7th, 2008 12:00 AM - Moisture Lifetime Testing of RF MEMS Switches Packaged in Liquid Crystal Polymer
June 7th, 2008 12:00 AM - Geometrical Design of Plate-Fin Heat Sinks Using Hybridization of MOEA and RSM
June 7th, 2008 12:00 AM - Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly
June 7th, 2008 12:00 AM - Evaluation of Thermal Resistance Matrix Method for an Embedded Power Electronic Module
June 7th, 2008 12:00 AM - Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components
June 7th, 2008 12:00 AM - On the Homogenization of Multilayered Interconnect for Interfacial Fracture Analysis
June 7th, 2008 12:00 AM - Driver IC and COG Package Design
June 7th, 2008 12:00 AM - Effect of Local Hot Spots on the Maximum Dissipation Rates During Flow Boiling in a Microchannel
June 7th, 2008 12:00 AM - Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
June 7th, 2008 12:00 AM
IEEE Trans. Electronics Packaging Mfg
- Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled at Various Tin–Lead Soldering Process Conditions
July 7th, 2008 12:00 AM - Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish
July 7th, 2008 12:00 AM - Combined Parameter and Tolerance Design for Quality via Computer Experiment: A Design for Thermoelectric Microactuator
July 7th, 2008 12:00 AM - Design and Evaluation of Bioepoxy-Flax Composites for Printed Circuit Boards
July 7th, 2008 12:00 AM - Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies
July 7th, 2008 12:00 AM - Dynamic Characteristics of a New Jetting Dispenser Driven by Piezostack Actuator
July 7th, 2008 12:00 AM - Table of contents
July 7th, 2008 12:00 AM - IEEE Transactions on Electronics Packaging Manufacturing publication information
July 7th, 2008 12:00 AM - IEEE Components, Packaging, and Manufacturing Technology Society information for authors
July 7th, 2008 12:00 AM - IEEE Components, Packaging, and Manufacturing Technology Society Information
July 7th, 2008 12:00 AM - Drop-on-Demand Solder Droplet Jetting System for Fabricating Microstructure
July 7th, 2008 12:00 AM - Study of Temperature Parameter in Au–Ag Wire Bonding
July 7th, 2008 12:00 AM - Scitopia.org
July 7th, 2008 12:00 AM - Leading the field since 1884
July 7th, 2008 12:00 AM - Quality without compromise
July 7th, 2008 12:00 AM
IEEE Circuits & Devices Magazine
- IEEE Circuits and Devices Magazine
December 31st, 1969 11:59 PM - IEEE Member Digital Library
December 31st, 1969 11:59 PM - IEEE Circuits and Devices - Table of contents
December 31st, 1969 11:59 PM - From the Editor - Going...Going ...Gone!!!
December 31st, 1969 11:59 PM - VLSI Designer's Interface
December 31st, 1969 11:59 PM - The CHIP - Peak Detectors for Multistandard Wireless Receivers
December 31st, 1969 11:59 PM - Super Junction LDMOS Transistors - Implementing super junction LDMOS transistors to overcome substrate depletion effects
December 31st, 1969 11:59 PM - Tackling 4G challenges with "TACT" - Design and optimization of 4G radio receivers with a transceiver architecture comparison tool (TACT)
December 31st, 1969 11:59 PM - Putting the "FLEX" in flexible mobile wireless radios - A wideband continuous-time baudpass sigma-delta ADC software radios
December 31st, 1969 11:59 PM - Predicting random jitter - Exploring the current simulation techniques for predicting the noise in oscillator, clock, and timing circuits
December 31st, 1969 11:59 PM - RF subsystems implemented in mainstream CMOS - Overcoming special concerns affecting performance and cost
December 31st, 1969 11:59 PM - Modeling and simulation of mixed-signal electronic designs - Enabling analog and discrete subsystems to be represented uniformly within a single framework
December 31st, 1969 11:59 PM - Embeded EEPROM Memory Achieving Lower Power - New design of EEPROM memory for RFID tag IC
December 31st, 1969 11:59 PM - Breaking the optical difraction barrier with nanophotonics - Ultrahigh-resolution bioimaging and biosensing in the subwavelength nanometric range with nanobiophotonic technologies
December 31st, 1969 11:59 PM - Ultraviolet laser beam and confocal microscopy - A system for rapid patterned photolysis
December 31st, 1969 11:59 PM
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